Skip to content

D Series H-Pin® Socket

D-Series H-Pin® Socket is a performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor. The D-Series line shares the same configurable features as other socket series in the Smiths Interconnect burn-in test portfolio. Leveraging H-Pin technology the D-Series line provides market-leading electrical performance, for high-speed burn-in applications.

Download Brochure

Features & Benefits

  • Design flexibility, in-house tooling and molds allow for the lowest cost of test.
  • Extensive catalog of components andconfigurable options
  • Proven track record of reducing the cost of test leveraging modular components, automated assembly, and short lead times.
  • Exceptional electrical performance providing wide RF bandwidth

Feature options

  • For QFN,QFP,LCC, SOIC, BGA, and LGA spring loaded plunger
  • Heat sink
  • HAST venting features
  • Integrated thermal control with heater and sensor.
  • Reverse seating plane
  • High temperature materials for above 200 °C applications

Related News

  • Image of Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

    BGA Sockets To Solve All Your Electronics Testing Needs

    Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.