- Available in 0.40 mm, 0.50 mm, 0.65 mm, 0.80 mm, and 1.00 mm pitches
- Custom pitches down to 0.30 mm
- Lidded and Open Top Sockets for ≤10 mm packages
- Lidded Sockets for 10 mm to 16 mm packages
- Center ground pin standard for all sockets
- Optional copper heat slug available for high wattage devices
- Sockets for over 80 different JEDEC standard footprints
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Smiths Interconnect announces breakthrough contact technology of Kepler test socket
Whether for testing high performance computing, wearables or other automotive chips, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry.
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Smiths Interconnect Offers Quick-Delivery Galileo Test Socket for Rapid Device Bring Up, Characterization, and Failure Analysis
Galileo is an innovative, low-profile test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.
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Test Laboratory Expansion in Suzhou
The Centre of Excellence will offer a one-stop-shop to the global customer base for the products used in semiconductor test applications.
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Smiths Interconnect honored as Outstanding Test and Measurement Company of the Year at the China IC Achievement Award
Smiths Interconnect, a leading provider of innovative test solutions for the semiconductor industry, won the China IC achievement award as the Outstanding Test and Measurement Company of the Year for its continuous innovation and rapid growth in the Chinese market.