- Available in 0.40 mm, 0.50 mm, 0.65 mm, 0.80 mm, and 1.00 mm pitches
- Custom pitches down to 0.30 mm
- Lidded and Open Top Sockets for ≤10 mm packages
- Lidded Sockets for 10 mm to 16 mm packages
- Center ground pin standard for all sockets
- Optional copper heat slug available for high wattage devices
- Sockets for over 80 different JEDEC standard footprints
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Raising the Bar of Burn-In Testing Sockets
Burn-in testing is widely used as an aid in producing failure-free electronic components. When scientifically planned and conducted, burn-in-testing sockets offer one of the most effective methods of reliability screening at the component level. Testing during production plays a vital role in ensuring reliability and repeatability. Semiconductor manufacturing plants perform tests at each stage of production to eliminate defective parts as early as possible while precisely controlling each process parameter of the chip.
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Smiths Interconnect expands into burn-in test market with acquisition of Plastronics
The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.
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Enhancing Customer Efficiency with Volta 200
New Volta 200 Series Offers Easy Maintenance of Spring Probe Technology for Finest Pitch Wafer Test
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Volta Product Pushes Testing Technology Boundaries
A High Performance, Cost-effective Alternative in Wafer Level Chip Scale Package Testing