Plastronics

Plastronics patented technologies are based on solving the difficult industry problems associated with high frequency, high current, low stable resistance and adequate contact travel to accommodate larger package footprints.

Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.

BGA sockets with the H-Pin provide a high-performance socket that is affordable for all burn-in operations. The BGA platform serves package sizes from as small as 6.0mm X 6.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.

Click on a BGA socket product in the table below to learn more.

SERIES NAME	PACKAGE SIZE	PITCH
Single Beam Socket	12.0mm X 12.0mm (max)	0.50mm – 0.80mm
Open Top H-Pin® Socket	9.0mm X 9.0mm (max)	0.50mm – 0.80mm
C-Series H-Pin® Socket	9.0mm X 9.0mm (max)	0.35mm – 0.80mm
D-Series H-Pin® Socket	20.0mm X 20.0mm (max)	0.50mm – 0.80mm
ES Micro H-Pin® Socket	20.0mm X 20.0mm (max)	0.40mm – .50mm
M-Series H-Pin® Socket	12.0mm X 12.0mm (max)	0 .50mm - 0.65mm
Q-Series H-Pin® Socket	31.0mm X 31.0mm (max	0.8mm - 1.0mm
ESJ	15.0mm X 15.0mm – 31.0mm X 31.0mm	0.50mm – 1.0mm
ES1	27.0mm X 27.0mm – 45.0mm X 45.0mm	1.0mm
ES2	45.0mm X 45.0mm – 60.0mm X 60.0mm	1.0mm