Plastronics patented technologies are based on solving the difficult industry problems associated with high frequency, high current, low stable resistance and adequate contact travel to accommodate larger package footprints.
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
BGA sockets with the H-Pin provide a high-performance socket that is affordable for all burn-in operations. The BGA platform serves package sizes from as small as 6.0mm X 6.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
Click on a BGA socket product in the table below to learn more.
|SERIES NAME||PACKAGE SIZE||PITCH|
|Single Beam Socket||12.0mm X 12.0mm (max)||0.50mm – 0.80mm|
|Open Top H-Pin® Socket||9.0mm X 9.0mm (max)||0.50mm – 0.80mm|
|C-Series H-Pin® Socket||9.0mm X 9.0mm (max)||0.35mm – 0.80mm|
|D-Series H-Pin® Socket||20.0mm X 20.0mm (max)||0.50mm – 0.80mm|
|ES Micro H-Pin® Socket||20.0mm X 20.0mm (max)||0.40mm – .50mm|
|M-Series H-Pin® Socket||12.0mm X 12.0mm (max)||0 .50mm - 0.65mm|
|Q-Series H-Pin® Socket||31.0mm X 31.0mm (max||0.8mm - 1.0mm|
|ESJ||15.0mm X 15.0mm –
31.0mm X 31.0mm
|0.50mm – 1.0mm|
|ES1||27.0mm X 27.0mm –
45.0mm X 45.0mm
|ES2||45.0mm X 45.0mm –
60.0mm X 60.0mm