D-Series H-Pin Socket | Smiths Interconnect

D Series H-Pin® Socket

D-Series H-Pin^® Socket is a performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor. The D-Series line shares the same configurable features as other socket series in the Smiths Interconnect burn-in test portfolio. Leveraging H-Pin technology the D-Series line provides market-leading electrical performance, for high-speed burn-in applications.

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Design flexibility, in-house tooling and molds allow for the lowest cost of test.
Extensive catalog of components andconfigurable options
Proven track record of reducing the cost of test leveraging modular components, automated assembly, and short lead times.
Exceptional electrical performance providing wide RF bandwidth

Feature options

For QFN,QFP,LCC, SOIC, BGA, and LGA spring loaded plunger
Heat sink
HAST venting features
Integrated thermal control with heater and sensor.
Reverse seating plane
High temperature materials for above 200 °C applications

Rethinking Blind Mate Connectors to Increase Reliability in Miniaturized Electronics Assembly

Creating more compact electronic components with higher functionality is a challenge for all electronics manufacturers. Whatever industry you're in, creating consumer, business, or military-grade electronics, the challenge presents itself, and the stakes are high. As electronics are expected to continue shrinking while increasing capabilities, blind mating connectors are required to meet those same size and functionality requirements.
Smiths Interconnect expands into burn-in test market with acquisition of Plastronics

The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.
FAQs at Smiths Interconnect: test sockets, capabilities, and support

After over 40 years of industry experience, Plastronics was acquired by Smiths Interconnect as the company’s one-stop shop for burn-in and reliability testing. As the complementary in-house burn-in division, we have also brought a wealth of knowledge and expertise in socket design and manufacturing.
Smiths Interconnect expands DaVinci test socket offering

The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.