- Available in 0.40 mm, 0.50 mm, 0.65 mm, 0.80 mm, and 1.00 mm pitches
- Custom pitches down to 0.30 mm
- Lidded and Open Top Sockets for ≤10 mm packages
- Lidded Sockets for 10 mm to 16 mm packages
- Center ground pin standard for all sockets
- Optional copper heat slug available for high wattage devices
- Sockets for over 80 different JEDEC standard footprints
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Smiths Interconnect enhances performance of its High-Density Signal PCB Connector
HPH Series supports a current rating of up to 9 Amps per contact and has a contact resistance of 7 mΩ max.
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Smiths Interconnect launches new PCB connector for rail and industrial applications
The Intercompact Series is Smiths Interconnect’s answer to the rail and industrial market growing demand for compact, high-speed, and reliable connectivity for ECU boxes, in the respect of severe material and electric current requirements.
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Meeting the increasing demand for rugged, high-speed connections in Space applications.
Space satellites market is evolving from RF Analog-based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. This type of architecture increases the demand for rugged and higher speed connectivity.
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Boosting the bottom line. Choosing the right contact technology for your connectivity.
As more pressure is put on industries to boost the bottom line, management is taking a closer look at all operating costs, including connectivity.